Why 3D glass semiconductor project is India's top chip bet, Pg19

Key Highlights:

• Foundation stone laid for India's first advanced 3D chip packaging unit in Bhubaneswar, Odisha.
• The project, led by US-based 3D Glass Solutions, was approved under the India Semiconductor Mission (ISM) with an investment of Rs 1,934 crore.
• The facility aims to produce glass substrate panels and advanced 3D heterogeneous integration modules for various sectors like AI, 5G, defence, and data centres.
• The plant is expected to produce 70,000 glass panels and 50 million assembled units annually, generating around 2,500 jobs.

Detailed Insights:

• The 3D glass chip packaging technology allows vertical integration of multiple chip components, increasing computing power within the same footprint, unlike traditional 2D packaging.
• Heterogeneous integration enabled by this technology is crucial for faster AI models, efficient data centres, and advanced defence electronics, meeting the demand for more power in smaller devices.
• The India Semiconductor Mission (ISM), launched in 2021 with an outlay of Rs 76,000 crore, aims to establish a full-stack chip ecosystem in India, including fabrication, packaging, design, and display manufacturing.
• The government is planning ISM 2.0 with an outlay of around $11 billion, focusing on supporting ancillary industries like gases, chemicals, and capital goods, along with a significant push for design-side incentives.

Scientific/Technical Concepts Involved:

• 3D Chip Packaging: A technology that stacks chips vertically to increase computing power and density.
• Glass Substrate: A glass-based material used as a base for building integrated circuits, offering better electrical and thermal properties.
• Heterogeneous Integration: Integrating diverse chip components (logic, memory, sensors) into a single package.