Odisha kicks off India's 1st 3D chip packaging plant, Pg15

Key Highlights:

• Odisha launched India's first 3D chip packaging plant in Bhubaneswar.
• The project is implemented by Heterogeneous Integration Packaging Solutions Pvt Ltd, a subsidiary of US-based 3D Glass Solutions Inc.
• The Rs 1,934-crore project is funded by Intel and others, with an expected annual production of 70,000 glass panels and 50 million assembled units.
• The plant is projected to create approximately 2,500 direct and indirect jobs.

Detailed Insights:

• The India Semiconductor Mission (ISM) approved the project last year, marking a significant step in India's semiconductor industry.
• 3D glass semiconductor technology uses glass substrates for high-performance, three-dimensional integration of electrical components.
• Glass offers better radio frequency performance, lower electrical loss, and enhanced thermal stability compared to silicon.
• The plant will assemble and package 13,000 advanced 3DHI modules, contributing to Odisha's transformation into an IT and electronics manufacturing hub.

Scientific/Technical Concepts Involved:

• 3D Chip Packaging: Advanced method of integrating multiple chips vertically to increase performance and reduce size.
• Semiconductor: A material with electrical conductivity between a conductor and an insulator, used in electronic devices.
• Glass Substrates: Specialized glass used as a base material in chip manufacturing, offering superior properties over silicon.